Sale!

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Original price was: ₨ 2,000.Current price is: ₨ 1,500.

Colour Matt Finished

WhatsApp us
SKU: 978-1032160818 Category:

Description

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)

Reviews

There are no reviews yet.

Be the first to review “Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments”

Your email address will not be published. Required fields are marked *

Related products